Wheat noodles
- Ingredients: Udon, Duck meat, Scallion/Green onion/Leek
- Flavor: Noodle dipping sauce
- Cooking: Boil, Simmer
tax included
Wheat noodles with tempura
- Ingredients: Udon, Shrimp
- Flavor: Noodle dipping sauce, Yuzu
- Cooking: Boil, Deep-fry
tax included
Dried wheat noodles served with shrimp tempura
Boiled wheat noodles cooled in cold water and served on a bamboo tray with a side of shrimp tempura.
- Ingredients: Udon, Shrimp, Smelt-whiting, Perilla, Eggplant, Squid
- Flavor: Noodle dipping sauce, Matcha salt, Tempura dipping sauce
- Cooking: Boil, Deep-fry, Chill
tax included
Wheat noodles in a curry broth
- Ingredients: Udon, Beef chuck, Onion, Scallion/Green onion/Leek
- Flavor: Curry powder, Noodle dipping sauce
- Cooking: Boil, Simmer
tax included
Wheat noodles straight-from-the-Pot
- Ingredients: Udon, Tofu, Scallion/Green onion, Ginger
- Flavor: Noodle dipping sauce, Sesame sauce
- Cooking: Boil
tax included
Chilled udon
Boiled udon cooled in cold water and served on a bamboo tray.
- Ingredients: Udon, Nori
- Flavor: Noodle dipping sauce
- Cooking: Boil, Chill
tax included
Chilled udon
Boiled udon cooled in cold water and served on a bamboo tray.
- Ingredients: Udon, Cucumber
- Flavor: Sesame sauce
- Cooking: Boil, Chill
tax included
Wheat noodles with sweet fried tofu
A dish of hot wheat noodles topped with deep fried tofu cooked in sweet soy sauce.
- Ingredients: Thin slice deep-fried tofu, Udon, Dried bonito
- Flavor: Noodle dipping sauce
- Cooking: Boil
tax included
Tanuki-style wheat noodles
A dish of wheat noodles sprinkled with tempura bits.
- Ingredients: Udon, Tempura scraps
- Flavor: Noodle dipping sauce
- Cooking: Boil
tax included
*Ingredients listed are representative and may not include everything in the dish.Additional ingredients may be used. Depending on season and availability, ingredients may change.
*Photos shown are for illustration purpose only.
*Price may vary.
* The price is in Japanese Yen (JPY)
Multiple Language Conversion System is Gurunavi's original system protected by patents (Japan Patent No. 5898365, No. 5952479)