Mapo noodles
- Ingredients: Ground meat, Tofu, Noodles
- Flavor: Chinese chili bean sauce
- Cooking: Boil, Simmer
tax included
Spicy tofu rice bowl
- Ingredients: Ground pork, Scallion/Green onion/Leek, Garlic, Rice, Tofu
- Flavor: Ginger
- Cooking: Stir-fry
tax included
Boiled gyoza
- Ingredients: Ground pork, Garlic
- Cooking: Boil
tax included
Chinese noodles in Sichuan-style sesame paste soup
- Ingredients: Scallion/Green onion/Leek, Cashew nut, Chinese noodles
- Flavor: Chinese chili bean sauce, Shaoxing wine, Red pepper
- Cooking: Boil
tax included
Chinese noodles mixed with Chinese sesame paste and chili oil
- Ingredients: Scallion/Green onion/Leek, Cashew nut, Chinese noodles
- Flavor: Chinese chili bean sauce, Shaoxing wine, Red pepper
- Cooking: Boil
tax included
Chinese noodles mixed with Chinese sesame paste and chili oil
- Ingredients: Scallion/Green onion/Leek, Cashew nut, Chinese noodles
- Flavor: Chinese chili bean sauce, Shaoxing wine, Red pepper
- Cooking: Boil
tax included
Other dishes served over rice
- Ingredients: Rice, Ground meat
- Flavor: Miso
tax included
Additional toppings
- Flavor: Chili oil
tax included
Additional toppings
- Flavor: Sichuan pepper
tax included
Grilled pork
- Ingredients: Pork
- Cooking: Bake/Roast
tax included
Grilled pork
- Ingredients: Pork
- Cooking: Bake/Roast
tax included
Cheese
tax included
Rice
tax included
Chopped green onion
- Ingredients: Scallion/Green onion/Leek
- Cooking: Cut
tax included
Additional toppings
- Ingredients: Ground meat
- Flavor: Miso
tax included
Coriander (extra)
- Ingredients: Coriander
tax included
Noodle
tax included
Additional toppings
- Ingredients: Peanut
tax included
*Ingredients listed are representative and may not include everything in the dish.Additional ingredients may be used. Depending on season and availability, ingredients may change.
*Photos shown are for illustration purpose only.
*Price may vary.
* The price is in Japanese Yen (JPY)
Multiple Language Conversion System is Gurunavi's original system protected by patents (Japan Patent No. 5898365, No. 5952479)